Siva P.V. Nadimpalli
Siva Nadimpalli received Bachelor’s degree in Mechanical Engineering from Andhra University (Vishakhapatnam, India) and Master’s degree in Mechanical Engineering from Indian Institute of Science (Bangalore, India). He worked for Wind Energy group at GE, Bangalore as a Mechanical Engineer from 2005 to 2006, and carried out projects involving fatigue analysis of wind turbine components and prototype testing of GE wind turbines. He moved to Canada in 2006 to pursue doctoral studies at University of Toronto. For his PhD, Siva Nadimpalli developed experimental techniques to characterize fracture behavior of solder joints and printed circuit boards in commercial microelectronic packages.
- Ph.D., Mechanical Engineering
University of Toronto, Toronto, Canada, 2011
- M.Sc. (Eng.), Mechanical Engineering
Indian Institute of Science, Bangalore, India, 2005
- B.E., Mechanical Engineering
Andhra University, Vishakhapatnam, India, 2002
Academic and Professional Appointments
- Assistant Professor, Mechanical and Industrial Engineering, NJIT, 2013 - present
- Mechanical Engineer, Nanowave Technologies Inc., Canada, 2013 – 2013
- Postdoctoral Research Associate, Brown University, 2011 – 2013
- Research Assistant, University of Toronto, Canada, 2006 – 2011
- Mechanical Engineer, GE Energy, Bangalore, India, 2005 – 2006
- Research Assistant, Indian Institute of Science, India, 2002 – 2005
- Research Intern, GM R&D Center, Warren, MI, 2003 – 2003
Awards and Honors
- Received the prestigious NSF CAREER award, March 1, 2017
- Recipient of Scholarship from the MHRD, Government of India, M.Sc. (Eng.) program, 2002 – 2004
- University of Toronto Fellowship, 2006 – 2010
- DCA Award, University of Toronto, 2010-2011
- DTCG Graduate Award, University of Toronto, 2010-2011
- Travel grant SES/ASME Conference, 2013
Dr. Nadimpalli’s research interests are in the area of experimental solid mechanics at nano and microscale. The main focus of his lab will be to use either existing experimental techniques or to develop new techniques and methods to address some of the issues pertaining to the mechanics of interface fracture, degradation, and failure of materials.
Energy Storage: one of the current focuses of Dr. Nadimpalli’s research is to understand and characterize various degradation (or failure) mechanisms of next generation lithium-ion battery electrode materials. He is especially interested in the interface fracture, delamination, and thin film fracture.
Microelectronics Packaging: Dr. Nadimpalli also has an interest in the area of Microelectronics reliability. He developed experimental techniques to characterize the mixed-mode fracture behavior of solder joints and applied these properties to predict the failure of solder joints in commercial packages such as BGAs and CTBGAs. He is interested in understanding the interface fracture behavior of joints under high strain-rate conditions as well as the failure behavior of various other interfaces in a complex microelectronic package structure, which is one of the primary issues that affect the reliability of the package.
- Siva P.V. Nadimpalli, Vijay Sethuraman, Pradeep R. Guduru, “On plastic deformation and fracture in Si films during electrochemical lithiation/delithiation cycling”, Vol.160, A1885-A1893, 2013, Journal of The Electrochemical Society.
- Giovanna Bucci, Siva P.V. Nadimpalli, Vijay Sethuraman, Allan F. Bower, Pradeep R. Guduru,“Measurement and modeling of the mechanical and electrochemical response of amorphous Si thin film electrodes during cyclic lithiation”, In Press, 2013, Journal of the Mechanics and Physics of Solids.
- Siva P .V. Nadimpalli, Vijay A Sethuraman, Swapnil Dhalavi, Brett Lucht, Michael Chon, Vivek Shenoy, Pradeep R Guduru, “Quantifying the capacity loss due to Solid-Electrolyte-Interphase layer formation in Li-ion batteries”, Vol.215, 145-151, 2012, Journal of Power Sources.
- Vijay Sethuraman, A. Nguyen, M.J. Chon, Siva P.V. Nadimpalli, H.Wang, D.P.Abraham, A.F. Bower, V.B. Shenoy, P.R. Guduru, “Stress evolution in composite silicon electrodes during lithiation/delithiatoin”, Vol. 160, 4, A739-A746, 2013, Journal of The Electrochemical Society.
- Siva P.V. Nadimpalli, Jan K. Spelt, “R-curve behavior of Cu-Sn3.0Ag0.5Cu solder joints:Eeffect of mode ratio and microstructure”, Vol. 527, 724-734, 2010, Material Science and Engineering A.
- Siva P.V. Nadimpalli, Jan K. Spelt, “Fracture load prediction of lead free solder joints”, Vol. 77, 3446-3461, 2010, Engineering Fracture Mechanics.
- Siva P.V. Nadimpalli, Jan K. Spelt, “Mixed-mode fracture load prediction of lead free solder joints”, Vol. 78, 317-333, 2011, Engineering Fracture Mechanics.
- Siva P.V. Nadimpalli, Jan K. Spelt, “Effect of geometry on the fracture behaviour of lead-free solder joints”, Vol.78, 1169-1181, 2011, Engineering Fracture Mechanics.
- Siva P.V. Nadimpalli, Jan K.Spelt, “Prediction of pad cratering fracture at the copper pad-printed circuit board interface”, Vol. 52, 1454-1463, 2012, Microelectronics Reliability.
- N. Siva Prasad Varma, R. Narasimhan.“ A Numerical Study of the effect of loading conditions on tubular hydroforming”, Vol. 196, 174-183, 2008, Journal of Materials Processing and Technology.
- N. Siva Prasad Varma, R. Narasimhan, Alan Luo, Anil.k.Sachdev. “An analysis of localized necking in aluminium alloy tubes during hydroforming using a continuum damage model”, Vol. 2, 200-209, 2007, International Journal of Mechanical sciences.